Tongfang LED industrial form of the first clue

The LED project will add 15 production lines or full production in 2009

The company holding 60% of the subsidiary core photoelectric is located in Hebei Langfang Industrial Zone, currently has 5 sets of MOCVD devices, the 5 devices are 6 core machine, photoelectric blue green high brightness LED chip production capacity of about 30KK particle / month.

The company plans in 2008 in Beijing Shunyi District Tianzhu Airport Free Trade Zone to build 15 production lines, the current 15 MOCVD equipment has reached the factory, 40 thousand square meters of factory construction will also have been completed in June, and will begin in July of October will enter the equipment installation, commissioning stage. By the end of 2008, the 15 production line is expected to continue production, the annual production capacity will reach 1 billion 500 million.

Currently in place of the 15 MOCVD are 6 machines, the main production of high luminous flux high brightness chip. Due to the current domestic demand for bright chips is more active, so the company considered the subsequent increase in the 30 new Taiwan's production of the proportion of the chip chip of the 19 machines.

The form of LED industrialization

The company plans to set up a subsidiary of Tongfang Optoelectronic Technology Co., Ltd., mainly engaged in the construction and operation of photovoltaic industry base, will become the company's optoelectronic industry management and investment platform. In order to simplify the management of the account, 15 LED production lines, 08 years are added into the same side of the photoelectric will name, but will still run by experienced core photoelectric to operate, then the photoelectric core will profit from the transfer to the same side of the photoelectric.

The company plans to extend the industrial chain to the downstream areas of the application of the product, while the same side of the main carrier of optoelectronic LED industrialization, mainly engaged in LED lighting, lighting engineering and other products and applications of R & D and production. In addition, the same side of the Shenyang Industrial Park will become the company's large size display backlight module application and production base.

Acquisition of Tinggi technology strength

The company has basically completed the acquisition of Singapore Tinggi company. The company is mainly engaged in the development of high power LED chip manufacturing technology, with LED substrate stripping technology and thermal conductivity of new substrate bonding technology, the vertical structure of chip separation technology, surface roughening technology and a number of basic patents. The application of 10A technology can make the highest withstand current LED chip, and the current mainstream chip can only withstand 350mA, which will promote the process of replacing incandescent LED.

Source: China Semiconductor Lighting Network