Chinese foundry industry "6 billion 600 million hidden opportunities to be busy at putting up installations"

Semiconductor equipment and materials international organization SEMI published before 2006 forecast, to 2008, the total sales of Chinese semiconductor equipment is expected to be $6 billion 600 million, slightly lower than the previous forecast for several months.

SEMI China President Mark Ding said, China's investment trends continue to evolve, compared to many of the previous projects, many of the more promising future wafer project will be settled in china. It is easier to raise funds and get government support for the wafer projects that bring advanced technology and significant foreign investment." At the same time, China's capital expenditure on semiconductor equipment is expected to jump in 2006, but is expected to slow growth in equipment market spending in 2007.

SEMI predicted in 2006 that China will spend $7 billion 400 million on semiconductor devices between 2006 and 2008, an increase of about $870 million over the previous estimate. In 2004, China's semiconductor industry is developing rapidly, the Group believes that the Chinese market has high hopes. But then some Fabs failed to start as planned, so the number of semiconductor equipment spending has shrunk.

However, if the other infrastructure and R & D spending on the wafer plant is calculated, SEMI expects China to spend more than $9 billion 800 million over the period. A separate device, SEMI believes that China's annual market purchases amounted to $3 billion, accounting for the proportion of the world's total from 6% in 2006 to 2009 of 7%. If China's semiconductor market is booming again, this is a conservative estimate.

SEMI said 300 mm Fab 70% will promote the sales of equipment, the next three years, at least five 300 mm Fab in the construction and installation of equipment, including foundry SMIC, Hynix ST and IDM/ Semiconductor memory manufacturer foundries Huahong NEC.

Allegedly, the new 300 mm wafer plant equipment spending will dominate the future market, entry-level technology for the process of 0.13 micron node. SEMI said that China's annual production capacity of the new wafer plant began to reflect the real market demand, by 2008, the annual capacity growth is expected to be 16%. Expected in the next three years, semiconductor material spending will grow steadily. Since the 2006 construction of the 300 mm wafer plant will be mostly in operation in 2007, wafer semiconductor material spending in 2007 may be increased by more than 58% in 2006.